GE CPU模塊IC693CPU313

采用隔離運(yùn)放的系統(tǒng)架構(gòu)和TI明星產(chǎn)品。涉及了相關(guān)電路設(shè)計(jì)和外部信號(hào)調(diào)理與MCU的配合。結(jié)合后級(jí)ADC，深入討論了隔離運(yùn)放單端結(jié)構(gòu)輸出和差分結(jié)構(gòu)輸出對(duì)整體采樣性能的影響，提供了相應(yīng)的分析和建議。

總結(jié)來說，如果采用內(nèi)置差分輸入ADC的MCU，比如C2000系列的TMS320F2837x，可以免去中間電路，直接將差分運(yùn)放的輸出接到對(duì)應(yīng)的差分輸入ADC模塊，同時(shí)獲得的精度和信噪比；如果采用內(nèi)置單端輸入ADC的MCU，添加一顆簡(jiǎn)單運(yùn)放比如TLV6001，可以在實(shí)現(xiàn)差分轉(zhuǎn)單端的同時(shí)進(jìn)行信號(hào)調(diào)理可以更加地適配后級(jí)ADC的輸入要求。如果想要省去額外調(diào)理運(yùn)放，可以采用一端電阻接地，但需要考慮對(duì)于采樣準(zhǔn)確度和信噪比的不良影響。

High Power Laser Module -- 900 mw -- Cutting Burning

900mw 808nm laser module 

High Power Laser Module -- 750 mw -- Cutting Burning

High Power Laser Module -- 400 mw -- Cutting Burning

High Power Laser Module 450 mw Cutting Burning diode

450mw 658nm laser burning high power laser diode

High Power Laser Module -- 290 mw -- Cutting Burning

290mw 780nm infrared laser (cutter)

290mw 780nm laser module burning high power diode

High Power Laser Module -- 260 mw -- Cutting Burning

High Power Laser Module -- 260 mw -- Cutting Burning

260mw 780nm laser module burning high power diode

High Power Laser Module -- 450 mw -- Cutting Burning

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